发明名称 PROCESS FOR MANUFACTURING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a process for manufacturing an electronic component in which strippability of a green sheet from a supporting sheet is enhanced, and short circuit failure rate is reduced. SOLUTION: The process for manufacturing an electronic component comprises a step for forming a green sheet on a supporting sheet, and a step for forming an electrode layer using electrode paste on the surface of the green sheet. The electrode layer formed on the surface of the green sheet is dried such that the stain occupation rate on the black side by SEM observation becomes 20% or less on the surface of the green sheet opposite to the side where the electrode layer is formed. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006060002(A) 申请公布日期 2006.03.02
申请号 JP20040240044 申请日期 2004.08.19
申请人 TDK CORP 发明人 SATO TATSUNORI;SUGAWARA SATOSHI
分类号 H01G4/12;H01G4/30 主分类号 H01G4/12
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