| 摘要 |
The present invention provides a spin cleaning and drying apparatus of single-wafer processing type which cleans a substrate with a cleaning liquid from a rinse nozzle while rotating the substrate and dries the substrate after cleaning while rotating the substrate, comprising: a spin chuck which holds and rotates the substrates; a cup which has an opening on an upper side, a water discharge port and an exhaust gas port in a bottom portion, and encloses the spin chuck; a flow regulating plate which has a gas injection port in a middle and is provided so as to be able to move backward and forward to a position opposed to the substrate and spaced therefrom at a prescribed distance and to an upward or sideward retracted position; and an exhaust cover, having multiple slit holes each with a hood which opens to an upper surface, is provided below the spin chuck.
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