发明名称 Aluminum/ceramic bonding substrate
摘要 There is provided an aluminum/ceramic bonding substrate having a high reliability to high-temperature heat cycles. An aluminum member of an aluminum alloy having a Vickers hardness of 35 to 45 is bonded to a ceramic substrate having a flexural strength of 500 to 600 MPa in three-point bending. The ceramic substrate is made of high-strength aluminum nitride, silicon nitride, alumina containing zirconia, or high-purity alumina. The aluminum alloy is an aluminum alloy containing silicon and boron, or an aluminum alloy containing copper.
申请公布号 US2006043574(A1) 申请公布日期 2006.03.02
申请号 US20050208246 申请日期 2005.08.19
申请人 发明人 OSANAI HIDEYO
分类号 H01L23/053 主分类号 H01L23/053
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