发明名称 LOW DEFECT DENSITY SILICON
摘要 PROBLEM TO BE SOLVED: To provide single crystal silicon, in ingot or wafer form, which contains an axially symmetric region which is free of agglomerated intrinsic point defects, and a method for producing it. SOLUTION: The method comprises controlling growth conditions, such as growth velocity v, instantaneous axial temperature gradient G<SB>o</SB>, and the cooling rate, within a range of temperatures at which silicon self-interstitials are mobile, in order to prevent the formation of the agglomerated defects. In ingot form, the axially symmetric region has a width, as measured from the circumferential edge of the ingot radially toward the central axis, which is at least about 30% the length of the radius of the ingot. The axially symmetric region additionally has a length, as measured along the central axis, which is at least about 20% the length of the constant diameter portion of the ingot. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006056779(A) 申请公布日期 2006.03.02
申请号 JP20050309456 申请日期 2005.10.25
申请人 MEMC ELECTRON MATERIALS INC 发明人 FALSTER ROBERT;JOSEPH C HOLZER
分类号 C30B29/06;C30B15/00;C30B15/14;C30B15/20;C30B15/22;C30B21/06;C30B27/02;C30B28/10;C30B30/04;C30B33/00;H01L21/322;H01L21/324 主分类号 C30B29/06
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