发明名称 OPTICAL SEMICONDUCTOR MODULE, ITS MANUFACTURING METHOD AND LSI PACKAGE WITH INTERFACE MODULE
摘要 PROBLEM TO BE SOLVED: To provide an optical semiconductor module which has a very simple structure and can perform collective mass production, and to provide the manufacturing method of the module and an LSI package with interface module. SOLUTION: The optical semiconductor module is provided with a photoelectric conjugate having an optical fiber 10, an optical semiconductor element 16 which is optically connected with the optical fiber 10 and has an electrode, and an extraction electrode 14 which is electrically connected to the electrode of the optical semiconductor element 16; a pattern electrode 20 which is electrically connected to the extraction electrode 14; and an optical element driving IC 8 which is electrically connected to a face opposite to a face of the pattern electrode 20 to which the extraction electrode 14 is electrically connected. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006059882(A) 申请公布日期 2006.03.02
申请号 JP20040237721 申请日期 2004.08.17
申请人 TOSHIBA CORP 发明人 FURUYAMA HIDETO;HAMAZAKI HIROSHI;NUMATA HIDEO;TAKUBO TOMOAKI
分类号 H01L31/02;H01L31/0232;H01S5/022 主分类号 H01L31/02
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