| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that a method using a conventional warpage reforming device needs to smoothly hold and press the edge of a printed circuit board so that a solder connecting step by a reflow furnace becomes complicated; and when the solder connection is performed while the warpage is correcting, the warpage becomes residual stress and then there occurs a cause that a crack arises in the printed circuit board. SOLUTION: A projection part 220 is provided in a thickness direction at the edge of the sheet-like circuit board 120 of a sheet-like circuit device 100. Thereby, the rigidity of the sheet-like circuit board 120 is improved, and a thermal deformation by a member for constituting the sheet-like circuit device 100 can be prevented. COPYRIGHT: (C)2006,JPO&NCIPI
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