发明名称 MANUFACTURING METHOD OF SOLDER POWDER FOR IMPROVING WET-SPREADING PROPERTY
摘要 PROBLEM TO BE SOLVED: To improve the wet-spreading property of solder by devising a soldering powder manufacturing method. SOLUTION: In the solder powder manufacturing method, a raw solder alloy is melted, the temperature of a molten solder alloy is adjusted to the liquidus temperature of the solder alloy +10 to +30°C, and the molten solder alloy is atomized at the temperature. It is confirmed that the wet-spreading property of the solder is improved both in the industrial applications and in the test, if the atomization temperature (the dripping temperature) of the molten solder alloy is set to the liquidus temperature of the solder alloy +10 to +30°C. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006055882(A) 申请公布日期 2006.03.02
申请号 JP20040240042 申请日期 2004.08.19
申请人 MITSUI MINING & SMELTING CO LTD 发明人 HORIGUCHI MAKOTO;MIYAKE KOICHI;ARAKI TAKAYUKI
分类号 B23K35/40;B22F1/00;B22F9/08;B23K35/22;H05K3/34 主分类号 B23K35/40
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