Halbleiteranordnung mit einem Leitersubstrat

摘要

A copper sheet 6 having an aperture provided therein at a bonding area for clearing the semiconductor chip 4 and its bonding wires 5 is bonded by an adhesive 3 to a sealing side of an organic substrate 1 which has been loaded on the sealing side with a pattern of copper foil wiring 2. The copper sheet 6 is higher in the adhesivity to a sealing resin 7 than any conventional resist. A resultant semiconductor device according to the present invention will prevent detachment of the sealing resin at interface which may result from a thermal history in the sealing or reflow process and eliminate entrance of water hence minimizing declination in the resistance to moisture.