METHOD AND CIRCUIT BOARD FOR PREVENTING DELAMINATION AND SAGGING

摘要

The present invention provides a method (1100) and circuit board panel (800) for substantially eliminating assembly-line delamination and sagging for complex circuit board manufacturing. The method includes: A) cutting/routing at least two apertures to fit into a circuit board profile, wherein a total length of the apertures is determined in accordance with a predetermined scheme (1102); and B) cutting/routing a channel/gouge on a top of the circuit board and another channel/gouge on a bottom of the circuit board along the circuit board profile through the apertures in accordance with a break-away scheme (1104). The channel/gouges are positioned at a predetermined horizontal critical distance apart with a predetermined vertical critical distance between a deepest cut edge of the channel/gouge on the top of the circuit board and a deepest cut edge of the channel/gouge on the bottom of the circuit board.