| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To prevent occurrence of interfacial delamination of a hydrophobic membrane to be used for interlayer dielectrics and a hydrophilic membrane to be used for a liner membrane or a barrier membrane in a multilayer wiring structure using the hydrophobic membrane like a low-k membrane. <P>SOLUTION: The electronic device is provided with a lower layer wiring 12 formed so as to bury the lower layer wiring groove 11a of a first interlayer dielectric 11 formed on a substrate which is not shown in the figure, the barrier membrane 13 formed on the lower layer wiring 12, and a second interlayer dielectric 14 formed on the first interlayer dielectric 11 and the barrier membrane 13. Then, the electronic device has an interface where the first interlayer dielectric 11 and the second interlayer dielectric 12 are connected. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
