| 摘要 |
PROBLEM TO BE SOLVED: To provide a ceramic package for housing electronic components along with its manufacturing method that has fine metallized pattern capable of preventing the occurrence of warping at a ceramic multilayer substrate, with no occurrence of a hollow part near the edge of inter-layer metallized pattern of the ceramic multilayer substrate for high reliability in airtightness. SOLUTION: A ceramic package 10 for housing electronic components comprises an interlayer metallized pattern 18 for forming electrical continuity in at least one area between layers of a ceramic multilayer substrate 13 comprising a plurality of laminating bodies. The interlayer metallized pattern 18 consists of a junction of a first metallized film 20 and a second matillized film 21. The pattern dimension of the first metallized film 20 is larger than the pattern of second metallized film 21, and the film thickness of the first metallized film 20 is equal to or thinner than the second metallized film 21. COPYRIGHT: (C)2006,JPO&NCIPI |
