发明名称 METHODS OF CUTTING OR FORMING CAVITIES IN A SUBSTRATE FOR USE IN MAKING OPTICAL FILMS, COMPONENTS OR WAVE GUIDES
摘要 The methods involve using a tool to cut or form multiple optical element shaped cavities in a surface of a substrate without rotating the tool or substrate during the cutting or forming process. At least some of the cavities are cut or formed to have at least two surfaces that come together to form a ridge and that are quite small relative to the length and width of the substrate. Thereafter the substrate is used to form optical films, components or wave guides having multiple optical elements on at least one surface corresponding to the cavities in the substrate.
申请公布号 WO2006023077(A2) 申请公布日期 2006.03.02
申请号 WO2005US22886 申请日期 2005.06.28
申请人 SOLID STATE OPTO LIMITED;PARKER, JEFFERY, R.;MC COLLUM, TIMOTHY, A.;EZELL, ROBERT, M.;STARKEY, KURT, R. 发明人 PARKER, JEFFERY, R.;MC COLLUM, TIMOTHY, A.;EZELL, ROBERT, M.;STARKEY, KURT, R.
分类号 G02B6/12;F21V5/00;F21V8/00 主分类号 G02B6/12
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