| 摘要 |
PROBLEM TO BE SOLVED: To provide an LSI package with an interface module in which high throughput of interface can be realized by eliminating such problems in packaging as the cost increases due to complication in structure and soldering interferes. SOLUTION: The LSI package 1 with an interface module comprises an interposer 3 mounting a signal processing LSI 2 and having a connection terminal 5, and an optical interface module 7 having an optical fiber 8 for delivering a high speed signal externally and an I/O pin 12 corresponding to a socket 13 wherein the interposer 3 and the optical interface module 7 are provided at least one of a loop electrode 16 and a flat electrode 20, respectively, and connected electrically by at least one of the loop electrode 16 and the flat electrode 20 through inductive coupling, electrostatic coupling and combination coupling thereof. COPYRIGHT: (C)2006,JPO&NCIPI |
