| 摘要 |
PROBLEM TO BE SOLVED: To prevent the contamination of a semiconductor device by waste from a dicing tape when a semiconductor wafer is cut by dicing blades into the semiconductor device. SOLUTION: The semiconductor wafer 1 is fixed to a wafer holder 5 with the dicing tape 2. While moving the rotating dicing blades 3 and 4 and the semiconductor wafer relatively to each other, the semiconductor wafer and the dicing tape are cut to individually separate a plurality of semiconductor elements in the semiconductor wafer. After the front surface side of the semiconductor wafer is cut to the middle of the thickness of the semiconductor wafer by a down-cut method, the rear surface side of the semiconductor wafer is cut by an uppercut method. Then, the dicing blade is cut into the dicing tape to completely cut the semiconductor wafer. An amount of a cut in the process of cutting the rear surface side is set smaller than that in the process of cutting the front surface side. COPYRIGHT: (C)2006,JPO&NCIPI |
