| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming wiring by plating, which provides high adhesiveness between a substrate and a wire, while forming the wiring by selective plating. SOLUTION: The wiring-forming method is a method for forming the wiring by selectively plating a conductor on a resin substrate, and comprises: an ozone water treatment step of contacting the surface of a substrate with ozone water; an exposure step of selectively irradiating the surface of the substrate with light; an alkaline treatment step of contacting the surface of the substrate with an alkaline treatment liquid; a catalyst-providing step of providing a plating catalyst on the surface of the substrate; and an electroless plating step of electroless-plating the conductor on the surface of the substrate. COPYRIGHT: (C)2006,JPO&NCIPI
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