发明名称 Semiconductor device and method of manufacturing semiconductor device
摘要 A Schottky junction is formed at the connection between an SOI layer and a contact (namely, under an element isolation insulating film) without forming a P<SUP>+</SUP> region with a high impurity concentration thereat. The surface of a body contact is provide with a barrier metal. A silicide is formed between the body contact and the SOI layer as a result of the reaction of the barrier metal and the SOI layer.
申请公布号 US2006043494(A1) 申请公布日期 2006.03.02
申请号 US20050210666 申请日期 2005.08.25
申请人 RENESAS TECHNOLOGY CORP. 发明人 IPPOSHI TAKASHI;IWAMATSU TOSHIAKI;MAEGAWA SHIGETO
分类号 H01L29/76 主分类号 H01L29/76
代理机构 代理人
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