| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which is further improved in both heat dissipation property and reliability by reducing a heat resistance of a die mount while increasing the connection reliability of the same. <P>SOLUTION: In the necessary part of the area on the surface of the die pad of a lead frame where a semiconductor chip is to be mounted, a conductive paste containing metal fine particles having the average grain diameter of 20 nm or less is applied to form a first conductive paste pattern. The semiconductor chip is mounted on the first conductive paste pattern, and then the first conductive paste pattern is heat-cured. Next, a conductive paste is applied to a region adjacent to the first conductive paste pattern to form a second conductive paste pattern, and the first and second conductive paste patterns are heat-cured. Thereafter, wire bonding and then resin sealing are conducted according to the prescribed methods. In this method, the second conductive paste pattern may be formed before mounting the semiconductor chip. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
