| 摘要 |
PROBLEM TO BE SOLVED: To form an electroless plating film having scheduled thickness, high uniformity within the surface and high uniformity among surfaces in electroless plating treatment, for instance, for the surface of a wired material buried in an interlayer insulation film, which is one of processes for manufacturing a semiconductor device. SOLUTION: This electroless plating apparatus has an upper thermoregulation body installed so as to face the surface of a substrate held in a substrate holder, which forms a chamber for passing a thermoregulating fluid, exchanges heat between the thermoregulating fluid and an electroless plating solution that passes through a supply passage routed therein for the electroless plating solution, and fills the electroless plating solution in a space between the upper thermoregulation body and the substrate, by spouting it out from the bottom surface side of the upper thermoregulation body. The electroless plating apparatus also has a lower thermoregulation body installed below the back surface of the substrate, which passes the thermoregulatng fluid therein, exchanges heat between the thermoregulating fluid and a fluid for the back surface side such as pure water, to thermoregulate the pure water, and fills the pure water in a space between the back surface of the substrate and the lower thermoregulation body. COPYRIGHT: (C)2006,JPO&NCIPI
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