发明名称 PRINTED WIRING BOARD AND IMPEDANCE MATCHING METHOD THEREFOR
摘要 <P>PROBLEM TO BE SOLVED: To provide a printed wiring board and an impedance matching method therefor for improving the characteristic impedance matching precision in a transmission line. <P>SOLUTION: The printed wiring board comprises a transmission line 14 having a dielectric 13 including a ferroelectric between a signal line 11 and a ground or a power supply line 12. The board is used to apply a strong electric field between the signal line 11 and the ground or the power supply line 12 and carry out the impedance matching of the transmission line 14. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006060112(A) 申请公布日期 2006.03.02
申请号 JP20040242014 申请日期 2004.08.23
申请人 TOPPAN PRINTING CO LTD 发明人 SASAKI NOBUO
分类号 H05K1/02;H01P3/04;H01P3/08 主分类号 H05K1/02
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