| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed circuit board that is contrived to increase the density of a circuit and to reduce its manufacturing cost, by forming two wiring patterns having 0.15 mm widths and to be passed through the mounting range of a surface-mounted chip component having 1608 size by a printing method and, in addition, is reduced in the deterioration of yield. <P>SOLUTION: The deterioration of the yield of the printed circuit board is reduced to 0.15 mm sized patterns (narrow width sections 15a/16a) to necessary minimum by forming wiring patterns 15/16 to have line widths of 0.25 mm line (broad line sections 15b/16b), in the range where the interval (distance between points 17a and 17b) between both lands 12 used for electrically connecting the surface-mounted chip component becomes such an interval (≥1.25 mm) that two wiring patterns having 0.25 mm line widths can be formed. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
