| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a structure of semiconductor package along with its manufacturing method, which is excellent in productivity for further reduction in thickness and miniaturization of a product with higher functions. <P>SOLUTION: A first resin layer 9 in which a conductor layer is laminated to provide adhesive characteristics, and thermoplasticity is heated. A protruded bump 3 formed at the terminal of a semiconductor device 2 is embedded in the first resin layer 9. The conductor layer is jointed to the bump 3, and the conductor layer is pattered to form a first circuit conductor 10a. Jointing particles 11 having conductivity are arranged at a prescribed position of the first circuit conductor 10a corresponding to the bump 3, and the first circuit conductor 10a is jointed to the jointing particles 11. A second resin layer 12 having adhesion characteristics and thermoplasticity in which another conductor layer is laminated is heated. The jointing particles 11 are embedded in the second resin layer 12, and another conductor layer of the second resin layer 12 is jointed to the jointing particles 11. Another conductor layer of the second resin layer 12 is pattered to form a second circuit conductor 10b. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
