| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic part-sealing resin which has a lowered thermal expansion coefficient and does not increase viscosity and volume elastic modulus. SOLUTION: This electronic part-sealing resin to be adhered to the periphery of an electronic part 2 loaded on a substrate 11 as ink for screen printing and then thermally cured to seal the electronic part is characterized in that the sealing resin 1 comprises a sealant, at least 5 wt.% of an organic filler for lowering a thermal expansion coefficient, and at least 5 wt.% of an inorganic filler for lowering the viscosity and the volume elastic modulus. COPYRIGHT: (C)2006,JPO&NCIPI
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