发明名称 Method for fabricating electrical connections of circuit board
摘要 A method for fabricating electrical connections of a circuit board is provided. The circuit board has a plurality of electrical connection pads thereon. A protective layer is applied on the circuit board and has a plurality of openings for exposing the electrical connection pads. A conductive layer is formed on the protective layer and the electrical connection pads. A resist layer is applied on the conductive layer and has a set of openings for exposing a portion of the conductive layer covering some of the electrical connection pads. A first metal layer is electroplated in the openings of the resist layer. Another set of openings are formed through the resist layer corresponding to the rest of the electrical connection pads. A second metal layer is electroplated on the first metal layer and above the rest of the electrical connection pads to form different electrical connections on the circuit board.
申请公布号 US2006043158(A1) 申请公布日期 2006.03.02
申请号 US20040023363 申请日期 2004.12.29
申请人 PHOENIX PRECISION TECHNOLOGY CORPORATION 发明人 WANG YING-TUNG
分类号 B23K35/12 主分类号 B23K35/12
代理机构 代理人
主权项
地址