发明名称 |
Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip for communication |
摘要 |
A semiconductor device includes a first substrate having a first surface for mounting an electronic component and a second surface substantially parallel to the first surface. The first substrate includes a first region for mounting the electronic component, a second region including a plurality of first communication units for transmitting and receiving signals to and from a second substrate, input-output circuits disposed on the first region or the second region, the input-out circuits corresponding to the first communication units, and a control circuit for controlling input to and output from the input-output circuits disposed on the first region or the second region of the first substrate. Each of the input-output circuits includes an output circuit for outputting a signal to a second communication unit of the second substrate corresponding to the first communication unit and an input unit for receiving a signal sent from the corresponding second communication unit.
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申请公布号 |
US2006043585(A1) |
申请公布日期 |
2006.03.02 |
申请号 |
US20050202180 |
申请日期 |
2005.08.12 |
申请人 |
SONY CORPORATION |
发明人 |
SUKEGAWA SHUNICHI;SEKINO TAKEO;SHIGENAMI KENICHI;TOI SHINICHI;SHIMIZU TATSUO |
分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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