发明名称 Method for making nano-scale lead-free solder
摘要 A method for making Nano-scale lead-free solder includes the following steps of: forming a mixture solution Sn-Ag or Sn-Ag-Cu; making NaBH<SUB>4</SUB>, NaOH and alkyl C<SUB>12</SUB>H<SUB>25</SUB>OSO<SUB>3</SUB>Na to a reducing dispersing solution; producing reactant Sn-Ag or Sn-Ag-Cu by means of the oxidation reduction method; and adding 95% ethanol to be mixed, and cleaning the reactant by using a supersonic vibrator for removing boron (B) and sulfur (S) atom which adhere to the reactant, thereby producing the Nano-scale (0.1~100 nm) lead-free solder Sn-3.5Ag or Sn-3.5Ag-xCu (x=0.2~1.0).
申请公布号 US2006042415(A1) 申请公布日期 2006.03.02
申请号 US20040928203 申请日期 2004.08.30
申请人 DUH JENG-GONG;HSIAO LI-YIN 发明人 DUH JENG-GONG;HSIAO LI-YIN
分类号 B22F9/24 主分类号 B22F9/24
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