Heat exchanger for cooling heat source e.g. integrated circuit, has interface layer, and manifold layer with first set of individualized fluid paths positioned to minimize pressure drop within heat exchanger

摘要

A heat exchanger comprises an interface layer in contact with a heat source and configured to pass fluid to cool the heat source; and a manifold layer coupled to the interface layer. The manifold layer has a first set of individualized fluid paths for channeling fluid to the interface layer. The fluid paths are positioned to minimize pressure drop within the heat exchanger. Independent claims are included for the following: (a) a manifold layer which can be coupled to an interface layer to form a microchannel heat exchanger; (b) a method of manufacturing a heat exchanger configured to cool a heat source, comprising: forming an interface layer configurable to be in contact with the heat source to pass fluid through it; forming the manifold layer to include inlet fluid path(s) and outlet fluid path(s); and coupling the manifold layer to the interface layer; (c) an electronic device which produces heat, comprising: an integrated circuit; an interface layer for cooling heat produced by the electronic device, integrally formed with the integrated circuit and configured to pass fluid through; and a manifold layer for circulating fluid with the interface layer; and (d) a closed loop system for cooling integrated circuit(s), comprising: heat exchanger(s) for absorbing heat generated by the integrated circuit, where the heat exchanger comprises: the interface layer and the manifold layer; pump(s) for circulating fluid through a loop, and coupled to the heat exchanger; and heat rejector(s) coupled to the pump and the heat exchanger. The inlet fluid path and the outlet fluid path are arranged to provide fluid flow at an optimal minimum fluid travel distance. The heat rejector is for cooling heated liquid output from the heat exchanger.