| 摘要 |
A chip fixed structure which is aiming at the better design of the adhesive body between the chip and the finger of the lead frame as well as its composite structure, which is to make said adhesive body with adhesion to form the stripe shapes with its width relatively smaller than the finger, through this to paste & settles a plurality of adhesive body on the upper lead facet of its dual-arrows or four-arrows fingers, also makes a chip pasting on the adhesive body which makes each arrow of lead frame carrying a chip and composite a fixed adhesive structure, so that it forms a structure with its width relatively smaller than the lead frame through said adhesive body as well as its composite formation, which allows the physical or chemical influences by the temperature change, thus maintaining the quality of chip as well as its usage lives. |
