<p>The flow rate of the electrolyte of the matting process is significantly increased by treating with an electrolyte containing copper in an acid (Copper alkydsulphate).</p>
申请公布号
EP1630258(A1)
申请公布日期
2006.03.01
申请号
EP20050018241
申请日期
2005.08.23
申请人
ENTHONE, INC.
发明人
VAN WIJNGAARDEN, CHRISTEL;SCHOETTLE, MARCO;KLEINFELD, MARLIES DR.;HEYER, JOACHIM DR.
