| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve the manufacturing efficiency and reliability of a semiconductor device in a method of manufacturing a semiconductor device having a chip size package structure, a mold for manufacturing the semiconductor device, the semiconductor device, and a mounting method thereof. <P>SOLUTION: A substrate 16, on which a plurality of semiconductor elements 11 are formed, is mounted in a cavity 28 of a mold 20. Bumps 12 are formed on the semiconductor elements 11. Further, the method comprises a resin sealing step of supplying resin 35 to placing positions of the bumps 12 to seal the bumps 12 and form a resin layer 13, a protruding electrode exposing step of exposing at least ends of the bumps 12, from the resin layer 13 which are covered with the resin layer 13 and a dividing step of cutting the substrate 16 together with the resin layer 13 to divide the substrate 16 and the resin layer 13 into the individual semiconductor elements 11. <P>COPYRIGHT: (C)2003,JPO</p> |
