| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a module of a mobile communication apparatus, which includes at least a front end module of a mutiband type, can secure a high yield and reliability, and can be miniaturized. SOLUTION: The module includes a substrate 8 having a multi-layered structure of a composite material made of resin or a mixture of resin and functional material and a semiconductor 19 incorporated in or mounted on the substrate 8. And it forms a front end module or a module of a mutiband type for mobile communication apparatus including the front end module. A diplexer 7 connected to an antenna is made of a ceramic chip. Further the diplexer 7 is incorporated in the substrate 8.</p> |
