Process for coating antimony containing substrate with tin or tin alloys

摘要

The process is for the non-stream metallizing of substrate material containing antimony (Sb) compounds with tin or tin alloys with removal of the Sb compound in the substrate material prior to surface metallizing. Independent claims are also included for the following: (i) an electrical switching carrier containing Sb compounds in a substrate material; and (ii) a conductive plate containing Sb compounds in a substrate material.