A printed circuit board having one or more vias disposed in the surface area of a pad. The pad may serve as a connection point between the printed circuit board and another circuit board and is disposed along the edge of the board such that the vias do not form half vias.
申请公布号
EP1631133(A1)
申请公布日期
2006.03.01
申请号
EP20050018904
申请日期
2005.08.31
申请人
SYNERGY MICROWAVE CORPORATION
发明人
ROHDE, META;PODDAR, AJAY KUMAR;REBEL, REIMUND;SCHOEPF, KLAUS JUERGEN