| 摘要 |
A radiation-sensitive resin composition comprising (A) a resin which comprises at least one recurring unit (I-1), (I-2), or (I-3), and a recurring unit (II), and is insoluble or scarcely soluble in alkali, but becomes alkali soluble by action of an acid, (B) a photoacid generator, and (C) a polycyclic compound. The resin composition is used as a chemically-amplified resist for microfabrication utilizing deep UV rays <chemistry id="CHEM-US-00001" num="000
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