INORGANIC FILLER, EPOXY RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE

摘要

BY REMOVING A FRACTION OF FINE PARTICLES HAVING A PARTICLE SIZE OF LESS THAN 2ΜM FROM STARTING INORGANIC FILLER PARTICLES HAVING A MEAN PARTICLE SIZE OF 10-50 µM AND ADDING THERETO PARTICLES HAVING A MEAN PARTICLE SIZE OF 0.1-2 . µM AND A SPECIFIC SURFACE AREA OF 3-10 M2/G (BET), THERE IS OBTAINED A PARTICULATE INORGANIC FILLER HAVING A MEAN PARTICLE SIZE OF 5-40 µM. WHEN A LARGE AMOUNT OF THE INORGANIC FILLER IS LOADED IN AN EPOXY RESIN COMPOSITION, THE COMPOSITION MAINTAINS A LOW MELT VISCOSITY ENOUGH TO MOLD AND IS EFFECTIVE FOR ENCAPSULATING A SEMICONDUCTOR DEVICE WITHOUT CAUSING DIE PAD DEFORMATION AND WIRE DEFORMATION. THE ENCAPSULATED SEMICONDUCTOR DEVICE IS HIGHLY RELIABLE.