发明名称 |
Process and structure for semiconductor package |
摘要 |
A packaging process for a semiconductor chip that includes the following steps. A carrier having an upper surface and a corresponding lower surface is provided. A photoresist layer is formed on the upper surface of the carrier. A plurality of photoresist openings that expose the carrier is formed in the photoresist layer. A plurality of openings that connects with the photoresist openings are formed in the carrier. A tape is attached to the lower surface of the carrier. The body is filled into the openings of the carrier. A chip is mounted onto the upper surface of the carrier and electrically connected therewith. Finally, the tape is removed from the lower surface of the carrier.
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申请公布号 |
US7005327(B2) |
申请公布日期 |
2006.02.28 |
申请号 |
US20030605056 |
申请日期 |
2003.09.05 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
KUNG WEI-CHUN;CHANG LIAMH-CHENG |
分类号 |
H01L21/44;H01L21/48;H01L21/68;H01L23/31;H01L23/498 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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