发明名称 |
Solder paste stencil manufacturing system |
摘要 |
A method and apparatus for manufacturing or assembling a plurality of printed circuit boards to reduce rework at a printed circuit board assembly facility, which may include the following: cutting a first solder paste stencil based on a first solder paste stencil data set on a solder paste stencil cutting machine or device; utilizing the first stencil to apply solder paste to a first printed circuit board at a manufacturing or assembly facility; identifying a solder paste error condition with solder paste error information on the first printed circuit board; transmitting the solder paste error information for remote analysis; generating an adjusted first data set; transmitting the adjusted first data set to the printed circuit board manufacturing or assembly facility; utilizing the adjusted first data set to cut another solder paste stencil based on the adjusted stencil data; and utilizing the adjusted first solder paste stencil to manufacture a second printed circuit board without the solder paste error condition.
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申请公布号 |
US7003871(B2) |
申请公布日期 |
2006.02.28 |
申请号 |
US20030677640 |
申请日期 |
2003.10.01 |
申请人 |
INTEGRATED IDEAS & TECHNOLOGIES, INC. |
发明人 |
RAY MICHAEL |
分类号 |
H01R43/00;H05K1/02;H05K3/12 |
主分类号 |
H01R43/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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