| 摘要 |
THE INVENTION RELATES TO AN APPARATUS FOR ENCAPSULATING WITH PLASTIC LEAD FRAMES CARRYING CHIPS, COMPRISING MUTUALLY MOVABLE MOULD HALVES(102,103) WHICH IN THE CLOSED POSITION BOUND A MOULD CAVITY(133,145) FOR RECEIVING A LEAD FRAME, A FEED RUNNER CONNECTING ONTO THE MOULD CAVITY FOR SUPPLYING ENCAPSULATING MATERIAL AND A PLUNGER-CYLINDER(134,175) CONNECTED ONTO THIS FEED RUNNER FOR CARRYING UP ENCAPSULATING MATERIAL UNDER PRESSURE, CHARACTERIZED IN THAT AT A DISTANCE FROM THE HEAD END OF THE PLUNGER A PERIPHERAL GROOVE(170) IS ARRANGED WHICH IS CONNECTED TO THE HEAD END BY MEANS OF AT LEAST ONE FLOW CHANNEL(171,172).FIG 4
|
