| 摘要 |
There is provided a flexible circuit board (22) that, when deposited on another flexible circuit board (40), causes no gap to occur between wiring films (4a, 4a) of the flexible circuit board (40). Moreover, a plurality of flexible circuit boards are deposited on one another to provide a flexible multi-layer wiring circuit board having no gaps between the flexible circuit boards and having less bowing. In the flexible circuit board (22), the thickness of a bonding layer (16, 16a), on the side of a bowing metallic member (2), of an inter- layer insulating film (10) where which bumps (6) are formed is greater than the thickness of a bonding layer on the side of a metallic member (2). When the flexible circuit board (22) is deposited on the other flexible circuit board (40) to form a flexible multi-layer wiring circuit board (50), the bonding layer (16, 16a) can be filled between the wiring films (4a, 4a), so that the flexible multi-layer wiring circuit board (50) has no gaps and a less bowing. |
