| 发明名称 |
Chemical mechanical polishing and pad dressing method |
| 摘要 |
The invention provides a chemical mechanical polishing and pad dressing method based on differing the rotational of a pad dresser, head, and/or polishing pad to improve center removal slow profiling.
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| 申请公布号 |
US7004822(B2) |
申请公布日期 |
2006.02.28 |
| 申请号 |
US20030378024 |
申请日期 |
2003.02.28 |
| 申请人 |
EBARA TECHNOLOGIES, INC. |
发明人 |
MOLONEY GERARD STEPHEN;WANG HUEY-MING;LAO PETER |
| 分类号 |
B24B1/00;B24B37/04;B24B53/007;H01L21/304 |
主分类号 |
B24B1/00 |
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