发明名称 Photosensitive dielectric resin compositions filmsformed therefrom and semiconductor and display de vices encompassing such films
摘要 Some embodiments in accordance with the present invention relate to norbornene-type polymers and to photosensitive dielectric resin compositions formed therefrom. Other embodiments relate to films formed from such compositions and to devices, such as electrical, electronic and optoelectronic devices, that encompass such films.
申请公布号 SG119360(A1) 申请公布日期 2006.02.28
申请号 SG20050004827 申请日期 2005.07.07
申请人 PROMERUS, LLC 发明人 DINO AMOROSO;BRIAN BEDWELL;ANDREW BELL;EDMUND ELCE;DAOJI GAN;HO SEOK KANG;HIROAKI MAKABE;RAJA RAJESH PUTHENKOVILAKOM;RAMAKRISHNA RAVIKIRAN;ROBERT SHICK;YASUNORI TAKAHASHI;ETSU TAKEUCHI;XIAOMING WU
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