| 摘要 |
A capacitor is arranged at the closest position to a semiconductor element and the generation of switching noise is reduced as low as possible by increasing the processing speed, arranging the components highly intensively and reducing the operation voltage. One face of the capacitor is connected to an electrode of the electrode forming face of the semiconductor element and the other face of the capacitor is connected to the connection pads on the wiring board so that the capacitor is interposed between the electrode forming face of the semiconductor element and the semiconductor mounting face of the wiring board, the other face of the capacitor is connected to the connection pads on the wiring board, and at the same time, flip-chip connection is conducted on the connection pads on the wiring board via the solder bumps connected to the electrodes of the semiconductor element.
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