| 发明名称 |
Array printed circuit board |
| 摘要 |
The array printed circuit board includes at least one circuit board having a first surface. A first layout of first and second chip mounting regions is formed on a first half of the first surface and a second layout of first, and second chip mounting regions is formed on a second half of the first surface. The first and second layouts have opposite first and second chip mounting region patterns. |
| 申请公布号 |
US7005735(B2) |
申请公布日期 |
2006.02.28 |
| 申请号 |
US20040775070 |
申请日期 |
2004.02.11 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
PARK CHANG-YONG;KIM BYUNG-MAN;CHOI JONG-SOO;CHUN KWANG-HO;RYU SE-HYUNG |
| 分类号 |
H01L23/02;H01L23/12;H01L23/498;H01L25/065;H01L25/07;H01L25/18;H05K1/02;H05K1/18;H05K3/34 |
主分类号 |
H01L23/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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