摘要 |
A pair of connection terminals are connected to a head (4) and external terminals, respectively. Another pair of connection terminals are connected to a head IC for processing signals from the head. A pair of conductive paths connect respective pairs of connection terminals. A measurement terminal for measuring head IC, is located between two connection terminals. Independent claims are also included for the following: (a) Disk device; (b) Head integrated circuit testing method; (c) Head gimbal assembly manufacturing method
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