发明名称 FILM ADHERING METHOD AND APPARATUS FOR IT
摘要 PROBLEM TO BE SOLVED: To perform a lamination of a film under holding the film at a constant tension without providing a film adsorbing member and to able to protect a wrinkle or bubble from its generation. SOLUTION: A means of holding a tip and rear end of a cut film, a means of transporting the film held to a lamination roll and a means of charging a static electricity to the film transported to the lamination roll are provided and the film at a state that the film is adsorbed to the lamination roll by static electricity is pressed to be adhered to a substrate. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006051825(A) 申请公布日期 2006.02.23
申请号 JP20050266206 申请日期 2005.09.14
申请人 HITACHI INDUSTRIES CO LTD 发明人 MIURA ATSUSHI;NUMAJIRI FUMIAKI;FUJII TAKESHI;HIRONAKA KOJI;TAKAHASHI KAZUO
分类号 B29C65/78;B29C65/02 主分类号 B29C65/78
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