发明名称 Strained semiconductor-on-insulator structures and methods for making strained semiconductor-on-insulator structures
摘要 The present invention relates to semiconductor-on-insulator structures having strained semiconductor layers. According to one embodiment of the invention, a semiconductor-on-insulator structure has a first layer including a semiconductor material, attached to a second layer including a glass or glass-ceramic, with the CTEs of the semiconductor and glass or glass-ceramic selected such that the first layer is under tensile strain. The present invention also relates to methods for making strained semiconductor-on-insulator layers.
申请公布号 US2006038227(A1) 申请公布日期 2006.02.23
申请号 US20050196866 申请日期 2005.08.03
申请人 AITKEN BRUCE G;GADKAREE KISHOR P;DEJNEKA MATTHEW J;PINCKNEY LINDA R 发明人 AITKEN BRUCE G.;GADKAREE KISHOR P.;DEJNEKA MATTHEW J.;PINCKNEY LINDA R.
分类号 H01L27/01 主分类号 H01L27/01
代理机构 代理人
主权项
地址