发明名称 |
Adhesive layer of material that is selectively hardened is bonded to thin semiconductor wafers |
摘要 |
<p>The semi conductor chips [2] are first located on a protective foil and an adhesive foil [4] placed in position together with a transport foil [9]. The adhesive is of a type that can be hardened by exposure to radiation. The gap [11] between the chips is not hardened and allows separation of the individual chips.</p> |
申请公布号 |
DE102004054147(A1) |
申请公布日期 |
2006.02.23 |
申请号 |
DE20041054147 |
申请日期 |
2004.11.08 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
BAUER, MICHAEL;JEREBIC, SIMON |
分类号 |
H01L21/304;H01L21/58;H01L21/78 |
主分类号 |
H01L21/304 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|