| 摘要 |
<P>PROBLEM TO BE SOLVED: To mount an electronic component with high density without increasing cost. <P>SOLUTION: Circuit boards 61 and 62 are laminated in order on an electronic circuit board 51 from the top. Flexible boards 63-1 and 63-2 having functions for electrically connecting the electronic circuit board 51 and unillustrated outer interface and other electronic circuit board are connected between the laminated circuit boards 61 and 62. Specifically, the flexible board 63-1 is electrically and mechanically connected to a left end 62L on an outermost face 62a of the circuit board 62 by solder, metal paste or an anisotropic conduction film. The flexible board 63-2 is electrically and mechanically connected to a right end 62R on the outermost face 62a of the circuit board 62 by metal paste or the anisotropic conduction film. This technology is applied to the electronic circuit board to which the flexible board is connected. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
