发明名称 ELECTRICAL CONTACT ENCAPSULATION
摘要 An electronic device (500) comprises a substrate (510) and an electrical contact (520) in contact with the dielectric layer (544) and electrically coupled with at least one resistor (518), a substrate carrier (540) including an electrical trace (542) electrically coupled to the electrical contact (520), a polymer (524) enclosing the electrical contact (520), and a substantially planar film (528) disposed over the electrical contact (520).
申请公布号 WO2006020345(A2) 申请公布日期 2006.02.23
申请号 WO2005US25991 申请日期 2005.07.22
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.;BENSON, BRAD;BRETL, FRANK J.;CHAPPELL, ELLEN L.;IGELMAN, M. JEFFERY;ZHANG, STEVE H. 发明人 BENSON, BRAD;BRETL, FRANK J.;CHAPPELL, ELLEN L.;IGELMAN, M. JEFFERY;ZHANG, STEVE H.
分类号 B41J2/14 主分类号 B41J2/14
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