| 摘要 |
A semiconductor wafer cleaning apparatus has loading unit with cassette mounted with semiconductor wafers; moving mechanism; inner bath; marangoni dryer; and knife for supporting the wafers. The marangoni dryer includes a hood for moving the wafers from the loader into the inner bath. It is movable in /!X-, /!Y-, and /!Z-directions to be tightly sealed to the inner bath. A semiconductor wafer cleaning apparatus comprises a loading unit (7) with cassette (5) mounted with semiconductor wafers (3); a moving mechanism (9a-b, 11a-c) extracting and moving the semiconductor wafers into a loader (13) apart from the loading unit; an inner bath (19) apart from the loader, in which the wafers are cleaned with a cleaning solution; a marangoni dryer (23) including a hood for moving the wafers from the loader into the inner bath; and a knife (21) supporting and moving the wafers. The marangoni dryer is movable in /!X-, /!Y-, and /!Z-directions to be tightly sealed to the inner bath. An Independent claim is also included for a method of cleaning a semiconductor wafer comprising loading a cassette into a loading unit, extracting the semiconductor wafers held on the cassette, moving the extracted wafers into the loader, mounting the wafers from the loader into the marangoni dryer, moving the marangoni dryer into an inner bath, moving the wafers from the dryer into the bath, cleaning he wafers with a cleaning solution, and lifting the wafers from the inner bath while drying solution fumes are sprayed from the top of the dryer. The cleaning solution is thus removed from the wafers by surface tension differences between the drying and cleaning solutions.
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