| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method suitable for manufacturing an electronic component, including an insulating film with a sufficient thickness for surface protection, and a bump part of sufficient height, while protecting open faults from occurring. <P>SOLUTION: The manufacturing method of an electronic component comprises steps of forming conductive connections in an opening on electrode pads 12, in a base material provided with the electrode pads 12 and an insulating film, having the openings corresponding to the electrode pads 12; and forming bumps 15 on the conductive connections so as to protrude from the openings, while being directly contacted with the conductive connections. The process for forming the bumps 15 includes steps of (a) placing solder balls 35 in respective openings of the insulating film, and (b) forming the bumps 15 from the solder balls 35 by subjecting them to heat treatment. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
